The XC2V1000-4FGG456I is a field-programmable gate array (FPGA) from Xilinx, belonging to the Virtex-II family and supplied in a 456-ball fine-pitch ball grid array (FBGA) package with an industrial operating temperature rating. Fabricated on a 0.15 µm CMOS process, this device integrates a substantial array of configurable logic blocks, embedded block RAM, and multiple digital clock managers (DCMs) that provide clock synthesis, deskew, and frequency multiplication. The architecture supports high-speed SelectI/O interfaces and offers the logic density and routing resources needed to implement moderately complex digital systems. Its -4 speed grade targets a balanced performance range for applications that do not demand the family’s maximum switching frequencies, while the industrial temperature suffix ensures reliable operation across extended thermal environments.
Typical applications for the XC2V1000-4FGG456I span industrial automation, defense electronics, medical instrumentation, and communications infrastructure, where the FPGA often serves in roles such as hardware acceleration, protocol bridging, digital signal processing, and real-time control. In aerospace and defense systems, it may be used for sensor interfacing or secure data handling; in factory automation, it can coordinate motion control or vision processing pipelines. As a mature product family, the Virtex-II series carries elevated obsolescence risk, making source-of-supply verification and lifecycle planning critical for long-term programs. Industrial-grade devices like this one mitigate thermal margin concerns in harsh installations, but procurement engineers should confirm authorized distribution channels and consider component authentication to avoid counterfeit risks in legacy designs.
| Attribute | Value |
|---|---|
| Number of LABs/CLBs | 1280 |
| Total RAM Bits | 737280 |
| Number of I/O | 324 |
| Number of Gates | 1000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 456-BBGA |
| Supplier Device Package | 456-FBGA (23x23) |
| Package Type (FGG456) | Pb-free wire-bond fine-pitch BGA, 1.00 mm ball pitch, 456 balls |
| Speed Grade | -4 |
| Temperature Range (suffix I) | I = Industrial, Tj = -40°C to +100°C |
| Block SelectRAM (18 Kbit Blocks / Max RAM) | 40 blocks of 18 Kbit, max RAM 720 Kbits |
| Maximum Distributed RAM | 160 Kbits |
| CLB Array (Row x Col) | 40 x 32 |
| DCMs | 8 |
| Max Available User I/O in FG456/FGG456 | 324 |
| Max I/O Pads | 432 |
| Slices | 5,120 |
| System Gates | 1M |
Download the current available datasheet for XC2V1000-4FGG456I.
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