XC3S400AN-4FGG400I

An end-of-life member of Xilinx’s Spartan-3AN FPGA family, the XC3S400AN-4FGG400I integrates 400K system gates of programmable logic with non-volatile in-system Flash configuration memory in a 400-ball fine-pitch FBGA package. Operating across the industrial temperature range of −40°C to +100°C, this 90nm device eliminates the need for an external boot PROM, delivering instant-on and secure single-chip configuration. The device provides 1,152 logic cells, 288 Kbits of block RAM, eight dedicated DSP slices for multiply-accumulate operations, and up to 311 user I/Os supporting LVCMOS, LVDS, and RSDS signaling. It has been widely deployed in industrial motor controllers, distributed I/O modules, sensor interface processing, and legacy avionics line-replaceable units where reprogrammable logic with integrated flash was fielded.

Xilinx has officially discontinued the XC3S400AN-4FGG400I; the part is no longer manufactured and is now classified as end-of-life. For defense, aerospace, and industrial programs sustaining long-lifecycle platforms, replacing this FPGA with a newer component would impose board respins, full requalification, and extended recertification timelines. ZZX Electronics supplies date-code traceable, factory-original sustaining stock of this obsolete part, offering procurement teams a drop-in solution that preserves existing hardware baselines without redesign cost or schedule risk. The industrial temperature grade and lead-free, RoHS-compliant FBGA package remain compatible with deployed assemblies, and every lot undergoes rigorous incoming inspection for authenticity and solderability.