Industry certifications and quality credentials
XCF32PFSG48C Xilinx BGA integrated circuit
Part Number

XCF32PFSG48C

Xilinx BGA Integrated Circuits
Available Stock
620 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Xilinx
Package
BGA
Stock
620 pcs
Date Code
2020
Datasheet
Open PDF

Overview

The XCF32PFSG48C is a 32-megabit in-system programmable Platform Flash PROM from Xilinx, engineered to store configuration bitstreams for SRAM-based FPGAs in high-reliability embedded systems. As a member of the XCFxxP series, this device supports JTAG programming and cascaded daisy-chaining, enabling a single download cable to configure multiple FPGAs or to expand memory depth for larger logic images. The 48-ball BGA (FS/G48) package offers a compact footprint suited to space-constrained printed circuit boards, while the non-volatile flash architecture retains configuration data without power and withstands thousands of program/erase cycles. Design revisions can be loaded in-system without requiring component removal, simplifying prototyping and field updates.

Typical deployment scenarios span industrial automation, defense electronics, avionics, and communications infrastructure, where FPGAs implement custom logic, DSP, or hardware-accelerated functions and require a trusted configuration source. The commercial temperature range (suffix “C”) targets controlled environments, though extended-temperature variants exist in the family for more stringent conditions. Procurement engineers should note that Xilinx Platform Flash PROMs have matured in their lifecycle, and many members of the XCFxxP family are either discontinued or under end-of-life notice, making authorized sourcing, long-term supply agreements, and obsolescence management critical to maintaining production continuity and avoiding counterfeit risk.

Additional Information

ManufacturerXilinx
Part NumberXCF32PFSG48C
PackageBGA
Available Stock620 pcs
Date Code2020

Technical Specifications

Attribute Value
Type Platform Flash PROM
Memory Size 32 Mbit
Voltage - Supply 1.8V, 3.3V
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount
Package / Case 48-pin FS
Qualification MIL-STD-883
Series Platform Flash XCFxxP
Operating Supply Current ICCINT 10 mA active (@33 MHz), 1 mA standby
Operating Supply Voltage 1.8 V (VCCINT)
Supply Voltage - Max 2.0 V
Supply Voltage - Min 1.65 V
Maximum Clock Frequency 33 MHz
Maximum Operating Temperature + 85 C
Minimum Operating Temperature - 40 C
Embedded Memory 33,554,432 bits (32 Mbit)
Product Platform Flash In-System Programmable Configuration PROM
Technology Low-Power Advanced CMOS NOR Flash Process

Datasheet

Download the current available datasheet for XCF32PFSG48C.

Download Datasheet

Related Part Numbers

Same Manufacturer

View all
XCF128XFTG64C Xilinx FTBGA integrated circuit
XCF128XFTG64C In Stock
Manufacturer: Xilinx Stock: 2,040
RFQ
XC18V04VQ44C Xilinx VQFP integrated circuit
XC18V04VQ44C In Stock
Manufacturer: Xilinx Stock: 1,860
RFQ
XC3S400AN-4FGG400I Xilinx FBGA integrated circuit
Manufacturer: Xilinx Stock: 974
RFQ
XC5VFX30T-2FFG665I Xilinx FBGA integrated circuit
Manufacturer: Xilinx Stock: 348
RFQ

Same Category

View all
HCPL-315J-500E Broadcom SOP integrated circuit
Manufacturer: Broadcom Stock: 10,008
RFQ
M95128-DRMN3TP/K STMicroelectronics SOP integrated circuit
Manufacturer: STMicroelectronics Stock: 9,200
RFQ
HCPL-2631-000E Broadcom SOP integrated circuit
Manufacturer: Broadcom Stock: 8,140
RFQ
12-393 Mercury X-tal DIP integrated circuit
12-393 In Stock
Manufacturer: Mercury X-tal Stock: 6,900
RFQ

Same Package

View all
AR6005G-CF1B-R QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,635
RFQ
MSM-8625-0-576NSP QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,606
RFQ
MSM-8625-0-576NSP-TR-00-0 QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,606
RFQ
GD82551IT Intel BGA integrated circuit
GD82551IT In Stock
Manufacturer: Intel Stock: 1,859
RFQ
Scroll to Top