A3P1000-FG256T

The A3P1000-FG256T is a flash-based ProASIC3 FPGA manufactured by Microchip Technology, delivered in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package. This device employs non-volatile on-chip flash memory to store configuration data, enabling true single-chip, instant-on operation without the external boot memory required by traditional SRAM-based FPGAs. The architecture provides inherent immunity to configuration-cell single-event upsets, a critical factor for high-altitude, space-adjacent, and safety-critical applications. The ProASIC3 family supports in-system reprogrammability while maintaining low static power consumption, and the 256-ball FBGA offers a compact footprint with a practical I/O count for moderate-density logic, bridging, and control-path integration.

Typical end-use scenarios include automotive engine-control modules, industrial motion controllers, avionics systems, and secure communications equipment. The “T” suffix designates an extended temperature range, qualifying the device for reliable operation from -40°C to +125°C and aligning it with harsh-environment automotive and industrial grade requirements. Because configuration logic is physically hardened in flash, the part reduces overall bill-of-materials complexity and avoids configuration-bitstream volatility concerns. From a procurement perspective, this is a mature product within Microchip’s long-lifecycle FPGA portfolio, but design and supply-chain teams should confirm the latest obsolescence status and roadmap commitments when planning sustained production in defense, aerospace, or other regulated sectors where requalification costs drive total cost of ownership.