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SM32C6713BGDPM30EP Texas Instruments BGA integrated circuit
Part Number

SM32C6713BGDPM30EP

Texas Instruments BGA Integrated Circuits
Available Stock
320 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Texas Instruments
Package
BGA
Stock
320 pcs
Date Code
2135
Datasheet
Open PDF

Online Order

Quantity Pricing

Quantity Unit Price Ext. Price
1+ $9.00 $9.00
10+ $8.25 $82.50
500+ $7.50 $3,750.00
1000+ $7.13 $7,130.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 320 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

A discontinued floating-point digital signal processor in Texas Instruments' C67x line, the SM32C6713BGDPM30EP integrates the C6713B core running at 300 MHz inside a 272-ball BGA package. The ‘EP’ suffix designates an Enhanced Product, meaning this device was manufactured under a controlled baseline with extended temperature performance and additional qualification testing, historically suiting it for defense electronics, avionics, and rugged industrial systems. Its VLIW-based floating-point architecture handles demanding signal-chain workloads such as real-time radar processing, sonar beamforming, software-defined radio modems, and high-resolution industrial imaging.

Texas Instruments has officially discontinued the SM32C6713BGDPM30EP, and factory supply is no longer available. ZZX Electronics addresses the resulting sustainment gap by sourcing legacy inventory with full date-code and chain-of-custody traceability. This allows maintenance of fielded systems where a redesign or component requalification cycle is cost-prohibitive or would trigger lengthy recertification processes, enabling end-of-life DSPs to be inserted as direct drop-in replacements that keep mission-critical platforms operational without a board respin.

Additional Information

ManufacturerTexas Instruments
Part NumberSM32C6713BGDPM30EP
PackageBGA
Available Stock320 pcs
Date Code2135

Technical Specifications

Attribute Value
Type Floating Point
Interface Host Interface, I2C, McASP, McBSP
Clock Rate 300MHz
Non-Volatile Memory External
On-Chip RAM 264kB
Voltage - I/O 3.30V
Voltage - Core 1.26V
Operating Temperature -55°C ~ 125°C (TC)
Mounting Type Surface Mount
Package / Case 272-BBGA
Supplier Device Package 272-BGA (27x27)

Datasheet

Download the current available datasheet for SM32C6713BGDPM30EP.

Download Datasheet

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