Micron’s MT29F32G08AFABAWP-IT:B is an end-of-life single-level-cell (SLC) NAND Flash memory device, now officially discontinued by the manufacturer. It delivers 32 Gbit of storage through an 8-bit asynchronous parallel interface, housed in a 48-pin TSOP package and rated for the full industrial temperature range of −40°C to +85°C. The SLC architecture provides inherently higher endurance and data retention compared to multi-level-cell alternatives, characteristics that made this device a staple in applications requiring reliable non-volatile code and data storage under extended thermal and operational stress.
Typical deployments for this component included boot media and data-logging arrays within industrial automation controllers, aerospace flight recorders, defense communications equipment, and high-reliability networking infrastructure—systems where field-proven memory behavior and long qualification cycles outweigh the appeal of newer, faster interfaces. For organizations maintaining these mature platforms, redesign to accommodate a modern NAND alternative often triggers prohibitive recertification costs and multi-year requalification timelines. ZZX Electronics addresses this by sourcing sustaining legacy stock of the MT29F32G08AFABAWP-IT:B with full date-code traceability, helping design teams secure exact-drop-in replacements that preserve existing board layouts, firmware, and reliability certifications without forcing an unplanned bill-of-material change.
| Attribute | Value |
|---|---|
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 32Gbit |
| Memory Organization | 4G x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 48-TFSOP (0.724in, 18.40mm Width) |
| Supplier Device Package | 48-TSOP I |
Download the current available datasheet for MT29F32G08AFABAWP-IT:B.
Download Datasheet