The Teledyne e2v EV2A16AMNYU35 is a high-reliability 16-Megabit asynchronous SRAM organized as 2M x 16 bits and supplied in a TSOP surface-mount package. Engineered for long-lifecycle embedded applications, it operates from a single 3.3V power rail and provides a 35 ns access time, delivering fast, deterministic read/write cycles without the complexity of a clock or refresh circuitry. Its asynchronous parallel interface with independent byte controls simplifies interfacing with a broad range of microcontrollers, DSPs, and FPGAs, while the compact TSOP footprint supports dense board layouts for space-constrained designs.
This memory device is typically integrated into avionics flight computers, defense fire-control and guidance modules, industrial safety controllers, and high-uptime medical imaging systems where reliable data retention under shock, vibration, and extended temperature is critical. From a procurement perspective, Teledyne e2v positions this part within its sustained-lifecycle semiconductor portfolio, offering extended temperature screening, controlled bill-of-materials, and comprehensive traceability documentation suited to mil/aero and industrial qualification processes. Obsolescence risk is managed through the manufacturer’s long-term support commitments; sourcing teams should nevertheless account for extended lead times and supply chain discipline inherent to premium-grade, high-reliability memory components.
| Attribute | Value |
|---|---|
| Memory Size | 2M x 16 |
| Package / Case | TSOP |
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