Industry certifications and quality credentials
XC2V2000-5FG676I Xilinx FBGA integrated circuit
Part Number

XC2V2000-5FG676I

Xilinx FBGA FPGA
Available Stock
20 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Xilinx
Package
FBGA
Category
FPGA
Stock
20 pcs
Date Code
1229
Datasheet
Open PDF

Overview

Now an end-of-life FPGA from Xilinx’s Virtex-II family, the XC2V2000-5FG676I is a high-density programmable logic device packaged in a 676-ball fine-pitch BGA and specified for the industrial temperature range (-40°C to +100°C). Built on a 0.15 µm process, the Virtex-II architecture provides substantial logic fabric, dedicated 18 Kb block RAM columns, embedded 18×18 multipliers, and Digital Clock Managers (DCMs) for advanced clock synthesis and deskew. The -5 speed grade reflects a mid-range performance point within the family, and the 676-ball FBGA footprint delivers a high user-I/O count suited to data-path intensive and pin-constrained designs. These resources originally targeted signal processing, embedded control, and high-speed interfacing in platforms such as radar processors, software-defined radio, industrial automation controllers, and deployed military compute modules.

The XC2V2000-5FG676I has been officially discontinued by the manufacturer and is no longer in active production or factory-supported. For long-fielded systems—including certified avionics, defense electronics, and industrial machinery where a board respin or requalification cycle is cost-prohibitive or schedule-constrained—obtaining authentic, traceable legacy stock is essential. ZZX Electronics bridges that gap by sourcing sustaining inventories of this obsolete FPGA with full date-code traceability and rigorous visual inspection, helping design-sustainment teams secure drop-in replacements that extend operational life without altering form, fit, or function. In these environments, verified end-of-life stock becomes the practical path to maintaining mission-critical hardware while avoiding the risks of counterfeit parts.

Additional Information

ManufacturerXilinx
Part NumberXC2V2000-5FG676I
PackageFBGA
CategoryFPGA
Available Stock20 pcs
Date Code1229

Technical Specifications

Attribute Value
Number of LABs/CLBs 2688
Total RAM Bits 1032192
Number of I/O 456
Number of Gates 2000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Package Type (FG676) Wire-bond fine-pitch BGA, 1.00 mm ball pitch, 676 balls (non-Pb-free version)
Speed Grade -5
Temperature Range (suffix I) I = Industrial, Tj = -40°C to +100°C
Block SelectRAM (18 Kbit Blocks / Max RAM) 56 blocks of 18 Kbit, max RAM 1,008 Kbits
Maximum Distributed RAM 336 Kbits
CLB Array (Row x Col) 56 x 48
DCMs 8
Max Available User I/O in FG676/FGG676 456
Max I/O Pads 624
Slices 10,752
System Gates 2M

Datasheet

Download the current available datasheet for XC2V2000-5FG676I.

Download Datasheet

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