Industry certifications and quality credentials
XC2V2000-5FG676C Xilinx FBGA integrated circuit
Part Number

XC2V2000-5FG676C

Xilinx FBGA FPGA
Available Stock
20 pcs
Manufacturer
Xilinx
Package
FBGA
Category
FPGA
Stock
20 pcs
Date Code
0724
Datasheet
Open PDF

Overview

The Xilinx XC2V2000-5FG676C is a field-programmable gate array (FPGA) from the Virtex-II family, designed by Xilinx for high-performance logic integration in demanding embedded systems. Housed in a 676-ball fine-pitch ball grid array (FBGA) package and rated for commercial temperature range (0°C to +85°C), the device carries a -5 speed grade offering balanced timing closure within the Virtex-II product line. The architecture provides a fabric of configurable logic blocks, distributed and block RAM, digital clock managers, and high-speed I/O resources supporting LVDS and other differential standards. With a system gate count of approximately two million, the XC2V2000 variant addresses compute-intensive, logic-rich designs that require substantial on-chip memory and flexible interconnect.

Typical applications span industrial automation, test and measurement systems, aerospace and defense electronics, and telecommunications infrastructure where legacy Virtex-II designs remain deployed. The FPGA often functions in protocol bridging, digital signal processing, embedded control, and hardware acceleration roles that demand deterministic performance and long-life support. As a mature device from a legacy family, procurement planning must account for heightened obsolescence risk and constrained factory supply. The commercial temperature grade limits deployment to controlled environments and differs from the extended-range or military-screened variants sometimes specified in high-reliability programs. Availability relies predominantly on aftermarket distribution and existing inventory, reinforcing the need for proactive lifecycle management and verified sourcing strategies in sustainment applications.

Additional Information

ManufacturerXilinx
Part NumberXC2V2000-5FG676C
PackageFBGA
CategoryFPGA
Available Stock20 pcs
Date Code0724

Technical Specifications

Attribute Value
Operating Temperature 0°C ~ 70°C
Mounting Type Surface Mount
Package / Case 676-FBGA
Technology FPGA
Package Type (FG676) Wire-bond fine-pitch BGA, 1.00 mm ball pitch, 676 balls (non-Pb-free version)
Speed Grade -5
Temperature Range (suffix C) C = Commercial, Tj = 0°C to +85°C
Block SelectRAM (18 Kbit Blocks / Max RAM) 56 blocks of 18 Kbit, max RAM 1,008 Kbits
Maximum Distributed RAM 336 Kbits
CLB Array (Row x Col) 56 x 48
DCMs 8
Max Available User I/O in FG676/FGG676 456
Max I/O Pads 624
Slices 10,752
System Gates 2M

Datasheet

Download the current available datasheet for XC2V2000-5FG676C.

Download Datasheet

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