The XC2V1000-4FGG456C is a Xilinx Virtex-II field-programmable gate array supplied in a 456-ball fine-pitch ball grid array package, designed for high-performance logic integration in advanced digital systems. This device features a configurable logic fabric supported by embedded block RAM and dedicated 18×18-bit multipliers, enabling efficient implementation of complex arithmetic, DSP pipelines, and high-speed data-path functions. The -4 speed grade balances timing closure and power, while the commercial temperature range specifies operation from 0°C to +85°C ambient. Its SelectIO technology provides broad support for single-ended and differential I/O standards, including LVDS, LVPECL, and SSTL, alongside flexible clock management tiles that facilitate multi-clock domain designs.
Typical deployments span telecommunications infrastructure, industrial automation controllers, defense avionics processing, and medical imaging equipment—applications where deterministic performance and in-system reconfigurability are essential. As a mature Virtex-II device, the XC2V1000 remains available through authorized channels, though design teams should monitor lifecycle status and evaluate obsolescence risk given the family’s age. The FGG prefix denotes a lead-free, RoHS-compliant ball alloy, and the C suffix confirms commercial qualification rather than extended-temperature or MIL-screened variants. For aerospace, defense, or other high-reliability programs, procurement must validate that the commercial temperature envelope and qualification meet system-level requirements, and should implement controls to ensure supply continuity and component authenticity.
| Attribute | Value |
|---|---|
| Number of LABs/CLBs | 1280 |
| Total RAM Bits | 737280 |
| Number of I/O | 324 |
| Number of Gates | 1000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 456-BBGA |
| Supplier Device Package | 456-FBGA (23x23) |
| Package Type (FGG456) | Pb-free wire-bond fine-pitch BGA, 1.00 mm ball pitch, 456 balls |
| Speed Grade | -4 |
| Temperature Range (suffix C) | C = Commercial, Tj = 0°C to +85°C |
| Block SelectRAM (18 Kbit Blocks / Max RAM) | 40 blocks of 18 Kbit, max RAM 720 Kbits |
| Maximum Distributed RAM | 160 Kbits |
| CLB Array (Row x Col) | 40 x 32 |
| DCMs | 8 |
| Max Available User I/O in FG456/FGG456 | 324 |
| Max I/O Pads | 432 |
| Slices | 5,120 |
| System Gates | 1M |
Download the current available datasheet for XC2V1000-4FGG456C.
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