Industry certifications and quality credentials
XC2V1000-4FGG456C Xilinx FBGA integrated circuit
Part Number

XC2V1000-4FGG456C

Xilinx FBGA FPGA
Available Stock
129 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Xilinx
Package
FBGA
Category
FPGA
Stock
129 pcs
Date Code
1021
Datasheet
Open PDF

Overview

The XC2V1000-4FGG456C is a Xilinx Virtex-II field-programmable gate array supplied in a 456-ball fine-pitch ball grid array package, designed for high-performance logic integration in advanced digital systems. This device features a configurable logic fabric supported by embedded block RAM and dedicated 18×18-bit multipliers, enabling efficient implementation of complex arithmetic, DSP pipelines, and high-speed data-path functions. The -4 speed grade balances timing closure and power, while the commercial temperature range specifies operation from 0°C to +85°C ambient. Its SelectIO technology provides broad support for single-ended and differential I/O standards, including LVDS, LVPECL, and SSTL, alongside flexible clock management tiles that facilitate multi-clock domain designs.

Typical deployments span telecommunications infrastructure, industrial automation controllers, defense avionics processing, and medical imaging equipment—applications where deterministic performance and in-system reconfigurability are essential. As a mature Virtex-II device, the XC2V1000 remains available through authorized channels, though design teams should monitor lifecycle status and evaluate obsolescence risk given the family’s age. The FGG prefix denotes a lead-free, RoHS-compliant ball alloy, and the C suffix confirms commercial qualification rather than extended-temperature or MIL-screened variants. For aerospace, defense, or other high-reliability programs, procurement must validate that the commercial temperature envelope and qualification meet system-level requirements, and should implement controls to ensure supply continuity and component authenticity.

Additional Information

ManufacturerXilinx
Part NumberXC2V1000-4FGG456C
PackageFBGA
CategoryFPGA
Available Stock129 pcs
Date Code1021

Technical Specifications

Attribute Value
Number of LABs/CLBs 1280
Total RAM Bits 737280
Number of I/O 324
Number of Gates 1000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)
Package Type (FGG456) Pb-free wire-bond fine-pitch BGA, 1.00 mm ball pitch, 456 balls
Speed Grade -4
Temperature Range (suffix C) C = Commercial, Tj = 0°C to +85°C
Block SelectRAM (18 Kbit Blocks / Max RAM) 40 blocks of 18 Kbit, max RAM 720 Kbits
Maximum Distributed RAM 160 Kbits
CLB Array (Row x Col) 40 x 32
DCMs 8
Max Available User I/O in FG456/FGG456 324
Max I/O Pads 432
Slices 5,120
System Gates 1M

Datasheet

Download the current available datasheet for XC2V1000-4FGG456C.

Download Datasheet

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