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IDT72V275L15PFI Renesas Electronics TQFP integrated circuit
Part Number

IDT72V275L15PFI

Renesas Electronics TQFP Integrated Circuits
Available Stock
68 pcs
Manufacturer
Renesas Electronics
Package
TQFP
Stock
68 pcs
Date Code
1129
Datasheet
Open PDF

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Quantity Pricing

Quantity Unit Price Ext. Price
1+ $28.80 $28.80
10+ $26.40 $264.00
500+ $24.00 $12,000.00
1000+ $22.80 $22,800.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 68 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The IDT72V275L15PFI is a high-density synchronous FIFO (First-In, First-Out) memory device manufactured by Renesas Electronics, belonging to the 3.3 V CMOS SuperSync family and organized as a 64K × 18-bit buffer. This device provides independent read and write ports with dedicated clock inputs, enabling flexible data transfer between systems operating on different clock domains. A 15 ns cycle time supports high-speed operation, and on-chip features such as programmable almost-empty and almost-full flags, retransmit capability, and byte-symmetric architecture simplify depth expansion and bus-matching designs. The 18-bit word width makes the FIFO suitable for parity-enabled or wider data path architectures without external glue logic.

Applications for the 72V275 family span defense, aerospace, industrial automation, and telecom infrastructure, where the device acts as a rate buffer in digital signal processing chains, data acquisition front ends, or packet switching line cards. In mission-critical systems, it provides deterministic latency and back-pressure management between processors, FPGAs, or high-speed ADCs and DACs. The “I” suffix denotes an industrial temperature range of –40 °C to +85 °C, making the device appropriate for extended-environment deployments without requiring full military-grade screening. As a legacy IDT product now maintained under Renesas, lifecycle continuity should be evaluated for long-term programs; engineers designing for sustained availability may need to consider alternative sourcing strategies or last-time-buy planning. The TQFP package offers a compact, surface-mount footprint suitable for dense board layouts while ensuring reliable soldering and inspection for high-reliability manufacturing flows.

Additional Information

Part NumberIDT72V275L15PFI
PackageTQFP
Available Stock68 pcs
Date Code1129

Technical Specifications

Attribute Value
Operating Temperature -55°C ~ 125°C
Qualification MIL-STD-883
Package / Case TQFP
Mounting Type Surface Mount

Datasheet

Download the current available datasheet for IDT72V275L15PFI.

Download Datasheet

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