A3P400-FGG256I

The A3P400-FGG256I is a ProASIC3 Flash FPGA manufactured by Microchip Technology, supplied in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package. As a member of the ProASIC3 family, this non-volatile device leverages 130 nm flash technology to deliver instant-on operation, eliminating the need for external configuration memory. It provides approximately 400,000 system gates, integrated SRAM blocks, and phase-locked loops (PLLs) for clock management. The flash-based architecture ensures very low static power consumption and inherent immunity to single-event upsets in configuration cells, while the “I” suffix designates an industrial temperature range of -40°C to +100°C. Reprogrammable in-system, the FPGA supports secure design protection through Microchip’s FlashLock technology.

Typical end-use scenarios span industrial automation, motor control, aerospace and defense, medical imaging, and secure communications systems where reliability, low power, and reduced board complexity are critical. The device frequently serves as a system glue logic controller, protocol bridge, or embedded processor companion in high-reliability interfaces. From a procurement standpoint, the ProASIC3 series targets long-lifecycle applications, with Microchip maintaining extended availability for industrial and mil-temp grades, thereby mitigating obsolescence risk. The lead-free FBGA package meets RoHS requirements, and the absence of an external boot device simplifies supply chain and qualification overhead. Design teams value the single-chip, non-volatile nature for applications that must power up predictably and resist configuration tampering.