Industry certifications and quality credentials
XC2VP70-6FF1517C Xilinx FBGA integrated circuit
Part Number

XC2VP70-6FF1517C

Xilinx FBGA FPGA
Available Stock
30 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Xilinx
Package
FBGA
Category
FPGA
Stock
30 pcs
Date Code
941
Datasheet
Open PDF

Online Order

Quantity Pricing

Quantity Unit Price Ext. Price
1+ $1,008.00 $1,008.00
10+ $924.00 $9,240.00
500+ $840.00 $420,000.00
1000+ $798.00 $798,000.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 30 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The Xilinx XC2VP70-6FF1517C is a field-programmable gate array (FPGA) from the Virtex-II Pro family, designed by Xilinx to deliver high-performance logic processing with embedded system capabilities. Housed in a 1517-ball fine-pitch BGA package, this component combines a substantial fabric of configurable logic blocks with dedicated hard IP, including one or more IBM PowerPC 405 processor cores and multiple RocketIO multi-gigabit serial transceivers. The Virtex-II Pro platform provides abundant block RAM, digital clock managers, and advanced I/O resources, enabling complex digital signal processing, high-speed data movement, and system-on-chip integration. The commercial temperature range (C suffix) and -6 speed grade define its operational envelope and timing performance for standard-environment deployments.

Typical applications for this FPGA span wired and wireless telecommunications infrastructure, industrial control and imaging equipment, and aerospace/defense systems requiring high-bandwidth data handling and embedded processing. Design teams often select parts like the XC2VP70 for line cards, test and measurement instruments, and protocol bridging applications where deterministic processing and serial connectivity are critical. From a procurement standpoint, the Virtex-II Pro family is a mature product line, and availability may be subject to long-term supply constraints or obsolescence risk, making lifecycle management and verified sourcing essential. The commercial grade is suitable for benign thermal environments, while designs targeting extended temperature or high-reliability deployments would require alternative temperature/grade variants. Careful evaluation of revision, moisture sensitivity, and authenticity is advised when integrating this device into industrial or extended-life programs.

Additional Information

ManufacturerXilinx
Part NumberXC2VP70-6FF1517C
PackageFBGA
CategoryFPGA
Available Stock30 pcs
Date Code941

Technical Specifications

Attribute Value
DigiKey Programmable Not Verified
Number of LABs/CLBs 8272
Number of Logic Elements/Cells 74448
Total RAM Bits 6045696
Number of I/O 964
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)

Datasheet

Download the current available datasheet for XC2VP70-6FF1517C.

Download Datasheet

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