The XC2VP30-6FF896C is a field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro family, combining reconfigurable logic with embedded processing and high-speed serial connectivity. The device features integrated 32-bit PowerPC 405 processor hard cores and multi-gigabit RocketIO transceivers capable of data rates up to 3.125 Gbps, housed in an 896-ball flip-chip BGA package (FF896). The -6 speed grade and commercial temperature range (0°C to +85°C) define its timing and environmental operating envelope. This platform architecture enables partial reconfiguration and hardware/software co-design, supported by the mature ISE design tool suite.
Typical applications span embedded computing, industrial automation, defense electronics, and telecommunications infrastructure where on-chip processing reduces board space and latency. The device frequently serves as a control-plane processor, protocol bridge, or signal processing node in legacy line cards, software-defined radio front ends, and aerospace payload controllers. From a procurement standpoint, the Virtex-II Pro family is no longer in active production; units available today are typically from end-of-life stock or authorized aftermarket channels. Designers maintaining long-lifecycle programs must assess obsolescence risk and validate traceability carefully. The commercial temperature grade limits deployment to controlled environments, distinguishing this variant from extended-temperature or military-qualified alternatives.
| Attribute | Value |
|---|---|
| Number of LABs/CLBs | 3424 |
| Number of Logic Elements/Cells | 30816 |
| Total RAM Bits | 2506752 |
| Number of I/O | 556 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 896-BBGA, FCBGA |
| Supplier Device Package | 896-FCBGA (31x31) |
| Product Type | Field Programmable Gate Array (FPGA) |
| Series | Virtex-II Pro |
| Number of Logic Elements | 30,816 logic cells (13,696 slices) |
| Operating Supply Voltage | 1.5 V (VCCINT); 2.5 V (VCCAUX) |
| Maximum Operating Temperature | +85 °C (Tj) |
| Minimum Operating Temperature | 0 °C (Tj) |
| Embedded Memory | 2,448 Kb block RAM (136 x 18 Kb blocks) |
| Number of I/Os | 556 |
| Product | FPGA |
Download the current available datasheet for XC2VP30-6FF896C.
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