Industry certifications and quality credentials
XC2VP30-6FF896C Xilinx FBGA integrated circuit
Part Number

XC2VP30-6FF896C

Xilinx FBGA FPGA
Available Stock
18 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Xilinx
Package
FBGA
Category
FPGA
Stock
18 pcs
Date Code
0806
Datasheet
Open PDF

Overview

The XC2VP30-6FF896C is a field-programmable gate array (FPGA) from Xilinx’s Virtex-II Pro family, combining reconfigurable logic with embedded processing and high-speed serial connectivity. The device features integrated 32-bit PowerPC 405 processor hard cores and multi-gigabit RocketIO transceivers capable of data rates up to 3.125 Gbps, housed in an 896-ball flip-chip BGA package (FF896). The -6 speed grade and commercial temperature range (0°C to +85°C) define its timing and environmental operating envelope. This platform architecture enables partial reconfiguration and hardware/software co-design, supported by the mature ISE design tool suite.

Typical applications span embedded computing, industrial automation, defense electronics, and telecommunications infrastructure where on-chip processing reduces board space and latency. The device frequently serves as a control-plane processor, protocol bridge, or signal processing node in legacy line cards, software-defined radio front ends, and aerospace payload controllers. From a procurement standpoint, the Virtex-II Pro family is no longer in active production; units available today are typically from end-of-life stock or authorized aftermarket channels. Designers maintaining long-lifecycle programs must assess obsolescence risk and validate traceability carefully. The commercial temperature grade limits deployment to controlled environments, distinguishing this variant from extended-temperature or military-qualified alternatives.

Additional Information

ManufacturerXilinx
Part NumberXC2VP30-6FF896C
PackageFBGA
CategoryFPGA
Available Stock18 pcs
Date Code0806

Technical Specifications

Attribute Value
Number of LABs/CLBs 3424
Number of Logic Elements/Cells 30816
Total RAM Bits 2506752
Number of I/O 556
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 896-BBGA, FCBGA
Supplier Device Package 896-FCBGA (31x31)
Product Type Field Programmable Gate Array (FPGA)
Series Virtex-II Pro
Number of Logic Elements 30,816 logic cells (13,696 slices)
Operating Supply Voltage 1.5 V (VCCINT); 2.5 V (VCCAUX)
Maximum Operating Temperature +85 °C (Tj)
Minimum Operating Temperature 0 °C (Tj)
Embedded Memory 2,448 Kb block RAM (136 x 18 Kb blocks)
Number of I/Os 556
Product FPGA

Datasheet

Download the current available datasheet for XC2VP30-6FF896C.

Download Datasheet

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