Now an end-of-life FPGA from Xilinx’s Virtex-II family, the XC2V2000-5FG676I is a high-density programmable logic device packaged in a 676-ball fine-pitch BGA and specified for the industrial temperature range (-40°C to +100°C). Built on a 0.15 µm process, the Virtex-II architecture provides substantial logic fabric, dedicated 18 Kb block RAM columns, embedded 18×18 multipliers, and Digital Clock Managers (DCMs) for advanced clock synthesis and deskew. The -5 speed grade reflects a mid-range performance point within the family, and the 676-ball FBGA footprint delivers a high user-I/O count suited to data-path intensive and pin-constrained designs. These resources originally targeted signal processing, embedded control, and high-speed interfacing in platforms such as radar processors, software-defined radio, industrial automation controllers, and deployed military compute modules.
The XC2V2000-5FG676I has been officially discontinued by the manufacturer and is no longer in active production or factory-supported. For long-fielded systems—including certified avionics, defense electronics, and industrial machinery where a board respin or requalification cycle is cost-prohibitive or schedule-constrained—obtaining authentic, traceable legacy stock is essential. ZZX Electronics bridges that gap by sourcing sustaining inventories of this obsolete FPGA with full date-code traceability and rigorous visual inspection, helping design-sustainment teams secure drop-in replacements that extend operational life without altering form, fit, or function. In these environments, verified end-of-life stock becomes the practical path to maintaining mission-critical hardware while avoiding the risks of counterfeit parts.
| Attribute | Value |
|---|---|
| Number of LABs/CLBs | 2688 |
| Total RAM Bits | 1032192 |
| Number of I/O | 456 |
| Number of Gates | 2000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Package Type (FG676) | Wire-bond fine-pitch BGA, 1.00 mm ball pitch, 676 balls (non-Pb-free version) |
| Speed Grade | -5 |
| Temperature Range (suffix I) | I = Industrial, Tj = -40°C to +100°C |
| Block SelectRAM (18 Kbit Blocks / Max RAM) | 56 blocks of 18 Kbit, max RAM 1,008 Kbits |
| Maximum Distributed RAM | 336 Kbits |
| CLB Array (Row x Col) | 56 x 48 |
| DCMs | 8 |
| Max Available User I/O in FG676/FGG676 | 456 |
| Max I/O Pads | 624 |
| Slices | 10,752 |
| System Gates | 2M |
Download the current available datasheet for XC2V2000-5FG676I.
Download Datasheet