Industry certifications and quality credentials
XC5VFX30T-2FFG665I Xilinx FBGA integrated circuit
Part Number

XC5VFX30T-2FFG665I

Xilinx FBGA FPGA
Available Stock
348 pcs
Lifecycle: Active
In production
Manufacturer
Xilinx
Package
FBGA
Category
FPGA
Stock
348 pcs
Date Code
2209
Datasheet
Open PDF

Overview

What is XC5VFX30T-2FFG665I? It is an AMD/Xilinx Virtex-5 FXT FPGA in the industrial-temperature, -2 speed-grade ordering combination. AMD DS100 lists 5,120 Virtex-5 slices and 32,768 logic cells, 64 DSP48E slices, 68 blocks of 36 Kbit RAM for 2,448 Kbit total block RAM, one PowerPC 440 processor block, one PCI Express endpoint block, four Ethernet MACs and eight RocketIO GTX transceivers. The former page called these GTP transceivers; DS100 identifies GTX for the FXT platform.

How does the suffix decode? In `-2FFG665I`, -2 is the speed grade, FF is the flip-chip fine-pitch BGA package, G is the RoHS package designation documented by AMD, 665 is the ball count, and I is the -40°C to +100°C industrial junction-temperature range. For XC5VFX30T in FF665, DS100 lists up to 360 user I/Os, eight GTX channels and a 27 × 27 mm package. ZZX Electronics lists 348 pcs with date code 2209. Before acceptance, verify the complete top marking and speed/temperature suffix, ball and substrate condition, moisture/reflow history, reball evidence if applicable, lot traceability and compatibility with the intended Xilinx ISE toolchain. Send an RFQ for current lot photos and inspection options.

Additional Information

ManufacturerXilinx
Part NumberXC5VFX30T-2FFG665I
PackageFBGA
CategoryFPGA
Available Stock348 pcs
Date Code2209

Technical Specifications

Attribute Value
Exact Orderable Model XC5VFX30T-2FFG665I
Family Virtex-5 FXT
Architecture 65 nm SRAM-based FPGA with embedded processing and serial connectivity
Virtex-5 Slices 5,120
Logic Cells 32,768
DSP48E Slices 64
Block RAM 68 × 36 Kbit blocks; 2,448 Kbit total
Maximum Distributed RAM 380 Kbit
PowerPC 440 Processor Blocks 1
PCI Express Endpoint Blocks 1
Ethernet MACs 4
RocketIO GTX Transceivers 8, up to 6.5 Gb/s per DS100 family description
Maximum User I/O in FF665 360
Speed Grade -2
Operating Junction Temperature -40°C to +100°C (industrial I grade)
Package FFG665 flip-chip fine-pitch BGA, 27 × 27 mm

Datasheet

Download the current available datasheet for XC5VFX30T-2FFG665I.

Download Datasheet

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