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XC7K410T-2FFG900I Xilinx BGA integrated circuit
Part Number

XC7K410T-2FFG900I

Xilinx BGA Integrated Circuits
Available Stock
100 pcs
Lifecycle: Active
In production
Manufacturer
Xilinx
Package
BGA
Stock
100 pcs
Date Code
1829
Datasheet
Open PDF

Online Order

Quantity Pricing

Quantity Unit Price Ext. Price
1+ $252.00 $252.00
10+ $231.00 $2,310.00
500+ $210.00 $105,000.00
1000+ $199.50 $199,500.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 100 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The XC7K410T-2FFG900I is a high-density field-programmable gate array (FPGA) from Xilinx, part of the Kintex-7 family fabricated on a 28 nm process to balance signal processing performance, power efficiency, and cost. It houses 410,000 logic cells in a 900-ball fine-pitch BGA (FFG900) package and carries the -2 speed grade with an industrial temperature range of -40°C to +100°C, as denoted by the ‘I’ suffix. The architecture integrates block RAM, DSP48E1 slices, and up to 16 GTX transceivers supporting line rates to 12.5 Gbps, enabling robust serial connectivity for protocols such as PCIe Gen2, XAUI, and CPRI. Advanced SelectIO resources provide wide-ranging single-ended and differential I/O standards, making the device well-suited for processing-intensive data paths and high-bandwidth bridging functions.

Typical deployments span aerospace and defense applications—including radar signal processing, electronic warfare, and secure communications—where the industrial temperature grade supports operation in thermally challenging environments. The FPGA is also employed in industrial automation, motor control, and high-reliability test and measurement equipment that demands deterministic low-latency processing. From a procurement perspective, the 900-ball BGA package requires careful moisture sensitivity handling and reflow profiling during assembly. The Kintex-7 series remains under Xilinx (now part of AMD) long-product-lifecycle management, but design and supply-chain teams should confirm current lead times and end-of-life roadmaps to align program timelines with ongoing availability.

Additional Information

ManufacturerXilinx
Part NumberXC7K410T-2FFG900I
PackageBGA
Available Stock100 pcs
Date Code1829

Technical Specifications

Attribute Value
DigiKey Programmable Not Verified
Number of LABs/CLBs 31775
Number of Logic Elements/Cells 406720
Total RAM Bits 29306880
Number of I/O 500
Voltage - Supply 0.97V ~ 1.03V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)

Datasheet

Download the current available datasheet for XC7K410T-2FFG900I.

Download Datasheet

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