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MPC8270CZUUPEA NXP Semiconductors TBGA integrated circuit
Part Number

MPC8270CZUUPEA

NXP Semiconductors TBGA Microprocessors
Available Stock
735 pcs
Lifecycle: Obsolete
End of life
Manufacturer
NXP Semiconductors
Package
TBGA
Category
Microprocessors
Stock
735 pcs
Date Code
2136
Datasheet
Open PDF

Online Order

Quantity Pricing

Quantity Unit Price Ext. Price
1+ $36.00 $36.00
10+ $33.00 $330.00
500+ $30.00 $15,000.00
1000+ $28.50 $28,500.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 735 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The NXP Semiconductors MPC8270CZUUPEA is a high-performance microprocessor from the PowerQUICC II family, integrating a Power Architecture processing core with advanced communication peripherals for embedded networking and control applications. Operating at 450 MHz, this device combines integer and floating-point execution capabilities with an on-chip memory controller, DMA engine, and a suite of serial interfaces—including Fast Ethernet, HDLC, and UART controllers—delivering deterministic data handling and protocol processing. The processor is housed in a 480-ball tape ball grid array (TBGA) package, supporting dense PCB layouts while providing effective thermal dissipation for sustained operation in elevated ambient environments.

Typical deployments span industrial automation controllers, telecommunications line cards, military mission computers, and high-reliability aerospace systems where continuous uptime, real-time response, and robust I/O aggregation are essential. The PowerQUICC II architecture has a proven track record in infrastructure equipment, and the MPC8270 variant remains in active use where designs require stable, long-lifecycle processing with legacy software compatibility. Procurement and engineering teams should assess the mature lifecycle stage of this family and plan for extended availability through authorized, traceable supply channels. Obsolescence mitigation, strict counterfeit avoidance, and temperature-range verification are critical considerations when sourcing this component for defense-grade or sustained industrial programs.

Additional Information

ManufacturerNXP Semiconductors
Part NumberMPC8270CZUUPEA
PackageTBGA
Available Stock735 pcs
Date Code2136

Technical Specifications

Attribute Value
Core Processor PowerPC G2_LE
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 450MHz
Co-Processors/DSP Communications; RISC CPM
RAM Controllers DRAM, SDRAM
Graphics Acceleration No
Ethernet 10/100Mbps (3)
USB USB 2.0 (1)
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 480-LBGA Exposed Pad
Supplier Device Package 480-TBGA (37.5x37.5)
Additional Interfaces I2C, SCC, SMC, SPI, UART, USART

Datasheet

Download the current available datasheet for MPC8270CZUUPEA.

Download Datasheet

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