The A3PE1500-1FGG676I is a high-density, low-power Flash-based Field Programmable Gate Array (FPGA) from Microchip Technology’s ProASIC3L family. It provides 1.5 million system gates and 300 user I/Os in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package, operating from a single 1.5 V core supply to minimize power consumption. As a non-volatile FPGA, it stores configuration data entirely on-chip, achieving live-at-power-up operation without external boot memory. The Flash-based architecture delivers inherent bitstream security, single-event upset immunity for configuration cells, and in-system reprogrammability for field updates.
Typical end uses span industrial automation, secure communications, avionics, defense electronics, and medical instrumentation, where instant-on capability, low static power, and reliability in harsh environments are essential. The industrial temperature range suffix “I” ensures stable operation from −40 °C to +85 °C, making it well-suited for embedded systems that demand a balance of ruggedness and cost efficiency without full military screening. From a procurement perspective, Microchip’s extended lifecycle support for the ProASIC3L family reduces obsolescence risk for programs requiring long-term availability, while the single-chip, non-volatile design simplifies bill-of-materials and supply chain management in high-reliability applications.
| Attribute | Value |
|---|---|
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 276480 |
| Number of I/O | 444 |
| Number of Gates | 1500000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
Download the current available datasheet for A3PE1500-1FGG676I.
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