Industry certifications and quality credentials
XQR5VFX130-1CN1752V Xilinx FCBGA1752 integrated circuit
Part Number

XQR5VFX130-1CN1752V

Xilinx FCBGA1752 Integrated Circuits
Available Stock
15 pcs
Manufacturer
Xilinx
Package
FCBGA1752
Stock
15 pcs
Date Code
18+
Datasheet
Open PDF

Overview

The XQR5VFX130-1CN1752V is a radiation-hardened field-programmable gate array (FPGA) from Xilinx’s Virtex-5QV family, designed for space-grade and high-reliability processing in the most demanding orbital and deep-space environments. This device is fabricated on an epitaxial CMOS process with inherent total ionizing dose (TID) tolerance and single-event latch-up (SEL) immunity, delivering up to 130,000 logic cells in a ceramic column grid array (CCGA/FCBGA1752) that ensures thermal and mechanical integrity through extreme vibration and thermal cycling. The architecture includes PowerPC 440 embedded processor blocks, dedicated DSP48E slices for high-throughput fixed-point signal processing, and multi-gigabit serial transceivers supporting protocols such as SpaceWire and Aurora, enabling on-board reconfigurable computing, image processing pipelines, and software-defined radio functions in a single chip.

Typical deployment scenarios involve payload controllers, command and data handling modules, and high-speed telemetry interfaces for geostationary communications satellites, interplanetary probes, and launch vehicle avionics where deterministic performance across a wide temperature range (typically –55°C to +125°C) is mandatory. Procurement for the /V suffix indicates fully qualified, Class-V rated flight silicon compliant with MIL-PRF-38535 QML Class V requirements, and export classification under ITAR/EAR must be assessed by the end user. Long lead times, configuration memory antifuse alternatives, and strict thermal profiling for assembly are standard considerations; engineers should plan lifecycle sustainment and obsolescence mitigation early, as this niche radiation-hardened product line follows a controlled qualification and traceability path rather than standard commercial semiconductor supply chains.

Additional Information

ManufacturerXilinx
Part NumberXQR5VFX130-1CN1752V
PackageFCBGA1752
Available Stock15 pcs
Date Code18+

Technical Specifications

Attribute Value
Mounting Type Surface Mount
Package / Case 1752-CBGA
Technology FPGA
GTX / User I/O under Package (CN1752) GTX Transceivers=18, I/O=836
Package Size 45 x 45 mm
Pin Count 1752
Logic Cells 131,072
Speed Grade (-1) -1
Temperature Grade (last character V) Tj = -55°C to +125°C
Block RAM Blocks, 18 Kb 596
Block RAM Blocks, 36 Kb 298
Max Block RAM (Kb) 10,728
Max Distributed RAM (Kb) 1,580
CLB Array (Row x Col) 200 x 56
CMTs 6
DSP48E Slices 320
Endpoint Blocks for PCI Express 3
Ethernet MACs 6
Max RocketIO GTX Transceivers 18
Max User I/O 836
Slices 20,480
Total I/O Banks 24

Datasheet

Download the current available datasheet for XQR5VFX130-1CN1752V.

Download Datasheet

Related Part Numbers

Same Manufacturer

View all
XCF128XFTG64C Xilinx FTBGA integrated circuit
XCF128XFTG64C In Stock
Manufacturer: Xilinx Stock: 2,040
RFQ
XC18V04VQ44C Xilinx VQFP integrated circuit
XC18V04VQ44C In Stock
Manufacturer: Xilinx Stock: 1,860
RFQ
XC3S400AN-4FGG400I Xilinx FBGA integrated circuit
Manufacturer: Xilinx Stock: 974
RFQ
XCF32PFSG48C Xilinx BGA integrated circuit
XCF32PFSG48C In Stock
Manufacturer: Xilinx Stock: 620
RFQ

Same Category

View all
HCPL-315J-500E Broadcom SOP integrated circuit
Manufacturer: Broadcom Stock: 10,008
RFQ
M95128-DRMN3TP/K STMicroelectronics SOP integrated circuit
Manufacturer: STMicroelectronics Stock: 9,200
RFQ
HCPL-2631-000E Broadcom SOP integrated circuit
Manufacturer: Broadcom Stock: 8,140
RFQ
12-393 Mercury X-tal DIP integrated circuit
12-393 In Stock
Manufacturer: Mercury X-tal Stock: 6,900
RFQ
Scroll to Top