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A3P1000-1FG256I Microchip Technology FBGA integrated circuit
Part Number

A3P1000-1FG256I

Microchip Technology FBGA FPGA
Available Stock
320 pcs
Lifecycle: Active
In production
Manufacturer
Microchip Technology
Package
FBGA
Category
FPGA
Stock
320 pcs
Date Code
2306
Datasheet
Open PDF

Online Order

Quantity Pricing

Quantity Unit Price Ext. Price
1+ $372.00 $372.00
10+ $341.00 $3,410.00
500+ $310.00 $155,000.00
1000+ $294.50 $294,500.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 320 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The Microchip A3P1000-1FG256I is a flash-based field-programmable gate array (FPGA) from the ProASIC3 family, delivering one million system gates in a 256-ball fine-pitch ball grid array (FBGA) package and rated for the industrial temperature range. Built on non-volatile flash technology, the device offers true single-chip instant-on capability without the need for external configuration memory, reducing board space and simplifying power sequencing. The architecture delivers low static and dynamic power consumption compared to SRAM-based alternatives, while integrated security features—including AES decryption and flash locking—guard intellectual property against unauthorized access and reverse engineering. The -1 speed grade provides a balanced combination of performance and deterministic timing for reliable system integration.

Typical applications include industrial motor controls, secure defense and aerospace communications modules, medical imaging processing, and high-reliability embedded computing where immediate power-up response and long-term availability are essential. The industrial temperature range of -40°C to +85°C supports deployment in thermally stressed or extended-life enclosures without forced cooling. For procurement and design engineers, the ProASIC3 family maintains a mature, long-lifecycle roadmap with Microchip’s ongoing supply assurance, minimizing bill-of-material risk by eliminating standalone configuration PROMs and reducing single-event-upset vulnerabilities commonly associated with volatile FPGA technologies. The 256-ball FBGA package enables dense PCB layouts while preserving accessible routing and inspection access for high-reliability manufacturing flows.

Additional Information

Part NumberA3P1000-1FG256I
PackageFBGA
CategoryFPGA
Available Stock320 pcs
Date Code2306

Technical Specifications

Attribute Value
DigiKey Programmable Not Verified
Total RAM Bits 147456
Number of I/O 177
Number of Gates 1000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FPBGA (17x17)

Datasheet

Download the current available datasheet for A3P1000-1FG256I.

Download Datasheet

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