Industry certifications and quality credentials
XC2V1000-4FG456I Xilinx FBGA integrated circuit
Part Number

XC2V1000-4FG456I

Xilinx FBGA Integrated Circuits
Available Stock
93 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Xilinx
Package
FBGA
Stock
93 pcs
Date Code
1305
Datasheet
Open PDF

Overview

The XC2V1000-4FG456I is a field-programmable gate array (FPGA) from the Xilinx Virtex-II family, providing one-million system-gate class logic integration in an industrial-grade 456-ball fine-pitch BGA package. Built on an advanced copper CMOS architecture, this device incorporates a high-performance fabric with configurable logic blocks, distributed and block RAM, dedicated 18×18-bit multipliers, and multiple Digital Clock Managers for precision clock synthesis and skew management. The -4 speed grade enables robust timing closure, while SelectIO technology supports a broad set of single-ended and differential I/O standards, simplifying interface design across mixed-voltage and high-speed parallel systems.

This FPGA is widely utilized in aerospace flight-control processing, defense radar and electronic warfare payloads, industrial servo and motor drive controllers, and high-availability telecommunications infrastructure, where deterministic low-latency logic and long lifecycles are critical. The -I temperature rating (-40°C to +100°C) and fine-pitch BGA construction suit embedded deployment in thermally demanding, vibration-prone environments. As a mature device from the Virtex-II portfolio, the XC2V1000-4FG456I faces elevated obsolescence risk, making it essential for procurement and sustaining engineering teams to source through distributors that enforce strict counterfeit avoidance and provide documented traceability, ensuring continued support for legacy platforms without the cost and validation burden of a premature redesign.

Additional Information

ManufacturerXilinx
Part NumberXC2V1000-4FG456I
PackageFBGA
Available Stock93 pcs
Date Code1305

Technical Specifications

Attribute Value
Number of LABs/CLBs 1280
Total RAM Bits 737280
Number of I/O 324
Number of Gates 1000000
Voltage - Supply 1.425V ~ 1.575V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)
Package Type (FG456) wire-bond fine-pitch BGA, 1.00 mm ball pitch, 456 balls
Speed Grade -4
Temperature Range (suffix I) I = Industrial, Tj = -40°C to +100°C
Block SelectRAM (18 Kbit Blocks / Max RAM) 40 blocks of 18 Kbit, max RAM 720 Kbits
Maximum Distributed RAM 160 Kbits
CLB Array (Row x Col) 40 x 32
DCMs 8
Max Available User I/O in FG456/FGG456 324
Max I/O Pads 432
Slices 5,120
System Gates 1M

Datasheet

Download the current available datasheet for XC2V1000-4FG456I.

Download Datasheet

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