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XC6VHX380T-2FFG1924I Xilinx FBGA integrated circuit
Part Number

XC6VHX380T-2FFG1924I

Xilinx FBGA Integrated Circuits
Available Stock
70 pcs
Lifecycle: Active
In production
Manufacturer
Xilinx
Package
FBGA
Stock
70 pcs
Date Code
2241
Datasheet
Open PDF

Online Order

Quantity Pricing

Quantity Unit Price Ext. Price
1+ $1,116.00 $1,116.00
10+ $1,023.00 $10,230.00
500+ $930.00 $465,000.00
1000+ $883.50 $883,500.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 70 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The XC6VHX380T-2FFG1924I is a high-density field-programmable gate array (FPGA) from Xilinx’s Virtex-6 HX family, optimized for logic-rich and DSP-intensive processing tasks in demanding embedded systems. Fabricated on a 40 nm process, this device belongs to the 380K logic cell class and integrates a substantial array of DSP48E1 slices for high-performance digital signal processing, along with multiple GTX high-speed serial transceivers supporting multi-gigabit data rates. The -2 speed grade delivers a balanced performance envelope for complex datapath and interface implementations, while the 1924-ball flip-chip BGA package offers dense I/O routing and robust signal integrity. With an industrial temperature range of -40°C to +100°C (denoted by the “I” suffix), the FPGA maintains full specification compliance across extended environmental conditions, making it suitable for ruggedized and thermally challenging deployments.

This device is commonly deployed in radar and electronic warfare processing chains, software-defined radio platforms, high-speed wired communication line cards, and industrial machine vision systems where parallel hardware acceleration and deterministic latency are essential. As a member of the mature Virtex-6 series, which remains in production but occupies a legacy node, procurement and design teams should evaluate long-term availability, potential lifecycle management requirements, and the availability of alternate sources or second-source options. The industrial temperature grade and Pb-free (FFG) package align with environmental compliance directives for aerospace, defense, and high-reliability industrial programs, but obsolescence risk merits careful consideration when architecting new designs with extended deployment timelines.

Additional Information

ManufacturerXilinx
Part NumberXC6VHX380T-2FFG1924I
PackageFBGA
Available Stock70 pcs
Date Code2241

Technical Specifications

Attribute Value
DigiKey Programmable Not Verified
Number of LABs/CLBs 29880
Number of Logic Elements/Cells 382464
Total RAM Bits 28311552
Number of I/O 640
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1924-BBGA, FCBGA
Supplier Device Package 1924-FCBGA (45x45)

Datasheet

Download the current available datasheet for XC6VHX380T-2FFG1924I.

Download Datasheet

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