The NXP Semiconductors PC755CMGU400LE is a 32-bit PowerPC RISC microprocessor clocked at 400 MHz, supplied in a flip-chip ball grid array (FCBGA) package. It belongs to the MPC755 family derived from the PowerPC 750 core, featuring a superscalar pipeline that issues up to three instructions per cycle, separate 32 kB L1 instruction and data caches, an integrated double-precision floating-point unit, and a memory management unit. The processor uses a 60x system bus interface that simplifies connection to companion chipsets such as the MPC107, supporting symmetric multiprocessing and efficient memory access in deeply embedded systems.
Typical deployments span high-reliability and long-lifetime applications: avionics flight-control computers, radar and sonar signal processing, missile guidance, and industrial safety controllers. The FCBGA package, combined with extended-temperature screening variants noted by the suffix code, allows operation in harsh thermal and vibration environments without sacrificing processing determinism. For procurement, this part number’s specialized suffix indicates a specific screening level, temperature range, or lead-free finish; exact specifications should be confirmed against NXP ordering documentation. As a legacy PowerPC device, ongoing supply may be subject to NXP’s product longevity commitments or end-of-life management, making authorized distribution, counterfeit mitigation, and lifecycle planning essential for defense and aerospace programs with multi-decade sustainment requirements.
| Attribute | Value |
|---|---|
| Package / Case | FCBGA |
| Package (series option, not tied to the GU position) | 360-ball CBGA or 360-ball PBGA |
| Core Supply Voltage | VDD 1.90 ~ 2.10 V (400 MHz grade) |
| I/O Supply Voltage | OVDD 2.375-2.625 V (2.5 V nominal) or 3.135-3.465 V (3.3 V nominal) |
| Processor Frequency (400 position) | 400 MHz |
| System Bus Frequency (SYSCLK) | 25 ~ 100 MHz |
| Die-junction Temperature | 0 ~ 105 °C |
| Storage Temperature | -55 ~ 150 °C |
| Application Modifier (L position) | 2.0 V ± 100 mV, 0 ~ 105 °C |
| Process Descriptor (C position) | HiP4DP process |
| Process Technology / transistor count | 0.22 um CMOS, six-layer metal; 6.75 M transistors |
| Revision Level (last character E) | Rev 2.8; PVR = 0008 3203 |
Download the current available datasheet for PC755CMGU400LE.
Download Datasheet