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PC7447AMGH1000NB NXP Semiconductors FCBGA integrated circuit
Part Number

PC7447AMGH1000NB

NXP Semiconductors FCBGA Microprocessors
Available Stock
204 pcs
Lifecycle: Obsolete
End of life
Manufacturer
NXP Semiconductors
Package
FCBGA
Category
Microprocessors
Stock
204 pcs
Date Code
2047
Datasheet
Open PDF

Overview

An end-of-life PowerPC G4 processor from NXP’s MPC7447A series, the PC7447AMGH1000NB delivers 1.0 GHz performance with the AltiVec 128-bit vector processing engine, encapsulated in a 360-contact flip-chip BGA (FCBGA) package. This 32-bit RISC microprocessor integrates a 512 KB on-die L2 cache and supports symmetric multiprocessing for compute-intensive embedded environments. Originally deployed in mission-critical aerospace, defense, and industrial control platforms, the device was valued for its high throughput and reliable operation in thermally constrained, conduction-cooled systems.

NXP has officially discontinued this part, and it is no longer in active production. ZZX Electronics supplies legacy stock of the PC7447AMGH1000NB with full date-code traceability and verification processes, enabling the sustained service of fielded platforms where a board redesign or new-part qualification carries prohibitive cost and timeline risk. When sourcing this processor for existing designs, procurement teams must confirm exact match to the original NXP part number suffix to ensure compatible mask revision, temperature grade, and package finish, as variations in the MPC7447A family can affect drop-in suitability in high-reliability applications.

Additional Information

ManufacturerNXP Semiconductors
Part NumberPC7447AMGH1000NB
PackageFCBGA
Available Stock204 pcs
Date Code2047

Technical Specifications

Attribute Value
Type Microprocessor
Core Processor PowerPC G4 (MPC7447A)
Data Bus Width 32-Bit
Speed 1.0 GHz
Voltage - Supply 1.0V (Core), 3.3V (I/O)
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount
Package / Case FCBGA
Part Status Active (Military)
Package (series option, not tied to the GH position) 360-ball ceramic BGA (HCTE), 25 × 25 mm, 1.27 mm (50 mil) pitch; RoHS CBGA and 360-pin ceramic LGA also available
Process Technology / transistor count / die size 0.13 µm CMOS nine-layer metal; 48.6 M transistors; 8.51 mm × 9.86 mm
Core Supply Voltage VDD = 1.3 V ± 50 mV (base datasheet Table 4); the N-suffix grade of this part number is 1.1 V ± 50 mV
I/O Supply Voltage OVDD = 1.8 V ± 5% or 2.5 V ± 5% (determined by BVSEL)
Processor Frequency (1000 position) 1000 MHz
System Bus Frequency (SYSCLK) 33 ~ 167 MHz
Die-junction Temperature 0 ~ 105 °C
Storage Temperature -55 ~ 150 °C
Application Modifier (N position) VDD = 1.1 V ± 50 mV
Cache L1 instruction 32 KB + data 32 KB; L2 512 KB unified cache
Revision Level (last character B) Rev 1.1; PVR = 8003 0101

Datasheet

Download the current available datasheet for PC7447AMGH1000NB.

Download Datasheet

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