| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $15.60 | $15.60 |
| 10+ | $14.30 | $143.00 |
| 500+ | $13.00 | $6,500.00 |
| 1000+ | $12.35 | $12,350.00 |
Prices exclude shipping and taxes. Click a tier row to set the quantity.
Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.
The PC755BMGU350LE is a 32‑bit RISC microprocessor from NXP Semiconductors, built on the proven PowerPC 750 architecture. Operating at 350 MHz, the device incorporates a superscalar execution pipeline, 32 KB of instruction cache and 32 KB of data cache on‑chip L1 memory, and a dedicated L2 cache interface that supports up to 1 MB of external synchronous SRAM. Its integrated floating‑point unit and memory management unit deliver efficient, deterministic performance for real‑time operating systems and compute‑intensive embedded workloads. The processor is supplied in a RoHS‑compliant flip‑chip ball grid array (FCBGA) package, enabling compact, thermally managed PCB implementations.
Typical deployments include avionics mission computers, radar and signal processing modules, ruggedized single‑board computers for defense platforms, and high‑availability industrial controllers that demand deterministic response and long‑term reliability. The LE suffix denotes a lead‑free finish and an extended temperature rating, aligning the part with strict aerospace and industrial environmental requirements. Because the MPC755 family represents a mature platform, procurement teams should monitor NXP’s product longevity status and plan lifecycle‑management strategies accordingly. The FCBGA format imposes precise board‑level assembly and thermal management demands; therefore, collaboration with experienced contract manufacturers familiar with high‑reliability reflow profiles is recommended.
| Attribute | Value |
|---|---|
| Package / Case | FCBGA |
Download the current available datasheet for PC755BMGU350LE.
Download Datasheet
