PC755BEGH350LE

The NXP Semiconductors PC755BEGH350LE is a 350 MHz PowerPC 755 RISC microprocessor in a 360-pin flip-chip ball grid array (FCBGA) package. Implementing the PowerPC architecture, it integrates a superscalar core with separate 32 KB instruction and data L1 caches, a double-precision floating-point unit, and a memory management unit. The processor interfaces to system memory and I/O via a high-performance 60x bus, supporting glueless connection to synchronous SRAM, SDRAM, and PCI bridges. Its fully static design and low-power modes suit clock-sensitive embedded environments where deterministic real-time performance is required.

Typical deployments include single-board computers, mission computers, and signal-processing blades in avionics, radar, electronic warfare, and rugged industrial control systems. The FCBGA package provides superior thermal dissipation and electrical characteristics for high-reliability applications, while the MPC755’s broad operating-system and toolchain support simplifies long-lifecycle program integration. Procurement teams should treat this series as a mature product; sustained demand from defense and aerospace programs has maintained availability beyond typical commercial timelines, but obsolescence planning remains important. The LE suffix denotes lead-free (RoHS) terminations and may reflect a specific industrial or extended temperature grade—engineers should reference NXP’s ordering documentation to confirm the exact screening level, device revision, and any required qualification data before committing to a design freeze.