Industry certifications and quality credentials
LTM8029MPY#PBF Analog Devices BGA integrated circuit
Part Number

LTM8029MPY#PBF

Analog Devices BGA Integrated Circuits
Available Stock
80 pcs
Lifecycle: Active
In production
Manufacturer
Analog Devices
Package
BGA
Stock
80 pcs
Date Code
2130
Datasheet
Open PDF

Overview

The LTM8029MPY#PBF is a step-down μModule regulator from Analog Devices, delivering a complete DC/DC conversion solution in a compact BGA package. This device accepts an input voltage up to 36V and provides a regulated output with up to 2A of continuous load current. As part of the μModule family, it integrates the switching controller, power MOSFETs, inductor, and passive components, significantly simplifying power supply design and reducing board space. Its BGA package offers low thermal resistance and robust mechanical reliability, complementing internal protection features such as output overvoltage and thermal shutdown.

Typical deployments include industrial automation, avionics, military communications, and other high-reliability embedded systems where space, thermal performance, and immunity to harsh conditions are critical. The MP suffix designates military-grade plastic encapsulation, rated for an operating junction temperature range of –55°C to +125°C, making it suitable for defense and aerospace applications with derating considerations. The #PBF suffix confirms RoHS-compliance with lead-free finish. Analog Devices maintains extended product lifecycle support for its μModule portfolio, reducing obsolescence risk for long-term programs; procurement engineers should verify exact availability and qualification status for mission-critical designs.

Additional Information

ManufacturerAnalog Devices
Part NumberLTM8029MPY#PBF
PackageBGA
Available Stock80 pcs
Date Code2130

Technical Specifications

Attribute Value
Type Non-Isolated PoL Module
Number of Outputs 1
Voltage - Input (Min) 4.5V
Voltage - Input (Max) 36V
Voltage - Output 1 1.2 ~ 18V
Current - Output (Max) 600mA
Applications ITE (Commercial)
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount
Package / Case 35-BBGA Module
Size / Dimension 0.44 in L x 0.25 in W x 0.13 in H (11.3mm x 6.3mm x 3.4mm)
Supplier Device Package 35-BGA (11.25x6.25)

Datasheet

Download the current available datasheet for LTM8029MPY#PBF.

Download Datasheet

Related Part Numbers

Same Manufacturer

View all
MAX490MJA/883B Analog Devices CDIP integrated circuit
Manufacturer: Analog Devices Stock: 7,500
RFQ
MAX490MJA Analog Devices CDIP integrated circuit
MAX490MJA In Stock
Manufacturer: Analog Devices Stock: 6,000
RFQ
MAX9768BETG+T Analog Devices TQFN-24 integrated circuit
MAX9768BETG+T In Stock
Manufacturer: Analog Devices Stock: 5,000
RFQ
DS1374C-33# Analog Devices SOIC integrated circuit
DS1374C-33# In Stock
Manufacturer: Analog Devices Stock: 3,726
RFQ

Same Category

View all
HCPL-315J-500E Broadcom SOP integrated circuit
Manufacturer: Broadcom Stock: 10,008
RFQ
M95128-DRMN3TP/K STMicroelectronics SOP integrated circuit
Manufacturer: STMicroelectronics Stock: 9,200
RFQ
HCPL-2631-000E Broadcom SOP integrated circuit
Manufacturer: Broadcom Stock: 8,140
RFQ
12-393 Mercury X-tal DIP integrated circuit
12-393 In Stock
Manufacturer: Mercury X-tal Stock: 6,900
RFQ

Same Package

View all
AR6005G-CF1B-R QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,635
RFQ
MSM-8625-0-576NSP QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,606
RFQ
MSM-8625-0-576NSP-TR-00-0 QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,606
RFQ
GD82551IT Intel BGA integrated circuit
GD82551IT In Stock
Manufacturer: Intel Stock: 1,859
RFQ
Scroll to Top