APA300-FG256M

The Microchip Technology APA300-FG256M is a ProASICPLUS flash-based field-programmable gate array (FPGA) that integrates approximately 300,000 system gates within a 256-ball fine-pitch ball grid array (FBGA) package, rated for military temperature operation. This non-volatile, single-chip device stores its configuration in on-chip flash cells, enabling true live-at-power-up capability and eliminating the need for external configuration memory. The flash architecture also provides inherent resistance to single-event upsets (SEU) compared to SRAM-based alternatives, along with low static power consumption and secure reprogrammability, making it well-suited for high-reliability environments where predictable boot behavior and data integrity are critical.

Typical end-use scenarios span defense avionics, missile guidance and control, secure communication payloads, satellite subsystems, and industrial safety controllers—any application demanding immediate functionality at power-on and tolerance of extended temperature ranges from −55°C to +125°C. The “M” suffix denotes full military temperature screening, while the fine-pitch BGA package supports compact, weight-constrained board designs common in aerospace and portable tactical systems. From a procurement perspective, ProASICPLUS devices occupy a mature product lifecycle; while Microchip continues to support long-term availability for defense and aerospace programs, design teams should verify the obsolescence roadmap and lead-time profiles, particularly for new designs where extended-life sourcing and qualification requirements are a primary concern.