The ACT-S128K32N-020P7EQ from Aeroflex Circuit Technology is a high-reliability multichip module (MCM) SRAM, delivered in a hermetic ceramic pin grid array (CPGA) package. Organized as 128K x 32 bits with a 20 ns access time, this device integrates multiple monolithic memory die within a single compact footprint to deliver dense, fast, and deterministic non-volatile-equivalent performance for mission-critical systems. The monolithic-level power-down standby modes, TTL-compatible I/O, and single 5 V supply operation are characteristic of the ACT-S128K32N family, while the multichip construction reduces board space and interconnect parasitics compared to discrete solutions. Aeroflex’s thin-film process and Class H or K equivalent screening flow ensure robust latch-up immunity and extended temperature range suitability, with the CPGA package providing superior thermal dissipation and mechanical resilience under severe environmental stress.
Typical deployment spans avionics flight computers, radar and electronic warfare signal processors, satellite telemetry and command subsystems, and downhole industrial instrumentation where deterministic access time and data integrity over wide temperature extremes are non-negotiable. The device is widely used in processing caches, frame buffers, and data acquisition ring-buffers within military and space-grade architectures. From a procurement standpoint, this Aeroflex part occupies a specialized, high-reliability niche often subject to long lead times and evolving lifecycle status due to foundry dependencies and the manufacturer’s consolidation under the CAES umbrella. Engineers should verify current production status, available screening options, and authorized distribution channels early in the design cycle, as counterfeit and EOL obsolescence risks are elevated for such application-specific radiation-tolerant memory modules.
| Attribute | Value |
|---|---|
| Operating Temperature | -55°C ~ 125°C |
| Memory Size | 128K x 32 |
| Qualification | MIL-STD-883 |
| Package / Case | CPGA |
| Mounting Type | Through Hole |
| DESC Part Number | 5962-9318709H4X |
| Package Code P7 | 1.085"SQ PGA, with shoulder |
| Package Description (P7/P3) | 66-Lead PGA-Type, 1.08"SQ x 0.160" max |
| Maximum Package Power Dissipation (F1, P2/P6, P3/P7) | 4.4 W |
| Maximum Signal Voltage to Ground | -0.5 to +7 V |
| Operating Supply Current 32 Bit Mode | 600 mA (-017 & -020 grades) |
| Power Supply Voltage | +4.5 V to +5.5 V |
| Standby Current | 80 mA (-017 & -020 grades) |
| Thermal Resistance (F1, P2/P6, P3/P7) | 2.0 °C/W |
| Access Time (Speed Grade) | 20 ns |
| Case Operating Temperature | -55 to +125 °C |
| Maximum Lead Temperature (10 seconds) | 300 °C |
| Storage Temperature | -65 to +150 °C |
| Die Count / Memory Type | 4 low-power CMOS 128K x 8 SRAM dice in a single MCM |
| Organization | 128K x 32 |
| Option Code N | None |
| Screening Code Q | MIL-PRF-38534 |
Download the current available datasheet for ACT-S128K32N-020P7EQ.
Download Datasheet