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WEDPY256K72V-166BM White Electronic Designs Corporation BGA integrated circuit
Part Number

WEDPY256K72V-166BM

White Electronic Designs Corporation BGA Integrated Circuits
Available Stock
172 pcs
Package
BGA
Stock
172 pcs
Date Code
2013
Datasheet
Open PDF

Overview

The WEDPY256K72V-166BM from White Electronic Designs Corporation is a high-speed synchronous pipeline burst SRAM organized as 256K x 72 bits, supplied in a ball grid array (BGA) package. As a speed grade 166 device, it leverages a fully synchronous interface with a pipeline architecture, enabling zero-wait-state burst cycles that deliver deterministic low-latency access for systems requiring fast, random memory transactions. This memory architecture supports single-cycle deselect, clock-controlled sleep modes, and separate byte-write enables, making it suitable for parity or error-correcting code schemes in high-integrity data paths. Operating from a single 3.3 V supply and featuring LVTTL-compatible I/Os, the device balances performance with power efficiency in dense, space-constrained layouts characteristic of embedded computing modules and ruggedized single-board computers.

Typical applications span mission-critical environments such as avionics processors, radar and electronic warfare subsystems, secure communications platforms, and industrial control systems where deterministic cache or buffer memory is essential. The White Electronic Designs pedigree positions this SRAM within high-reliability markets, often supporting extended temperature ranges and meeting stringent outgas and thermal cycling requirements demanded by defense and aerospace programs. Procurement engineers should note that White Electronic products frequently carry long lead times or face obsolescence challenges as legacy memory technologies phase out; verifying the manufacturer’s lifecycle status, alternate sourcing from authorized aftermarket suppliers, and adherence to counterfeit mitigation protocols are common steps when integrating this component into sustainment or new design-in projects.

Additional Information

Part NumberWEDPY256K72V-166BM
PackageBGA
Available Stock172 pcs
Date Code2013

Technical Specifications

Attribute Value
Memory Size 256K x 72
Package / Case BGA
Mounting Type Surface Mount
Package (B digit in the part number) 159 Plastic Ball Grid Array (PBGA)
Clock to output in High-Z (tKQHZ) 3.5 ns
Clock to output valid (tKQ) 3.5 ns
Output Buffer Supply (VCCQ) 2.375 V to 2.9 V
Output HIGH / LOW Voltage VOH ≥ 2.0 V; VOL ≤ 0.4 V
Supply Voltage (VCC) 3.135 V to 3.6 V
Address hold time (tAH) min 0.5 ns
Address setup time (tAS) min 1.5 ns
Clock Cycle Time (tKC) min 6.0 ns
Clock Frequency (tKF) 166 MHz
Clock HIGH Time (tKH) min 2.3 ns
Clock LOW Time (tKL) min 2.3 ns
Device Grade / Operating Temperature (last character M in the part number) Military, -55°C to +125°C
Storage Temperature (Absolute Maximum Ratings) -55°C to +150°C (BGA)
Organization / Device Type 256K x 72 Synchronous Pipeline SRAM

Datasheet

Download the current available datasheet for WEDPY256K72V-166BM.

Download Datasheet

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