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TMS32C6713BGDPA200 Texas Instruments BGA integrated circuit
Part Number

TMS32C6713BGDPA200

Texas Instruments BGA Integrated Circuits
Available Stock
394 pcs
Lifecycle: Active
In production
Manufacturer
Texas Instruments
Package
BGA
Stock
394 pcs
Date Code
2020
Datasheet
Open PDF

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Quantity Pricing

Quantity Unit Price Ext. Price
1+ $44.40 $44.40
10+ $40.70 $407.00
500+ $37.00 $18,500.00
1000+ $35.15 $35,150.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 394 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The TMS32C6713BGDPA200 is a floating-point digital signal processor (DSP) from Texas Instruments, built around the high-performance C67x very-long-instruction-word (VLIW) core. Operating at a core clock frequency of 200 MHz, it combines 32-bit fixed- and floating-point computation with an integrated two-level cache architecture, on-chip RAM, and a comprehensive peripheral set that includes multichannel buffered serial ports (McBSPs) and a host-port interface (HPI). The VLIW pipeline supports multiple instructions per cycle, delivering the precision and throughput required for dense signal processing algorithms.

Typical applications span radar, sonar, and electronic warfare processing, software-defined radio, medical imaging modalities such as ultrasound and CT reconstruction, and high-channel-count industrial vibration analysis. The device is housed in a 272-ball BGA package and is rated for standard commercial/industrial temperature ranges. Procurement engineers should recognize that while the TMS320C6713B family maintains a defined product lifecycle, shifting DSP roadmaps elevate the need to verify ongoing availability and end-of-life status for long-term programs. For defense, aerospace, or other high-reliability deployments, confirming the availability of extended temperature grades or military-screened variants is advisable to meet traceability and ruggedization requirements.

Additional Information

ManufacturerTexas Instruments
Part NumberTMS32C6713BGDPA200
PackageBGA
Available Stock394 pcs
Date Code2020

Technical Specifications

Attribute Value
Type Floating Point
Interface Host Interface, I2C, McASP, McBSP
Clock Rate 200MHz
Non-Volatile Memory External
On-Chip RAM 264kB
Voltage - I/O 3.30V
Voltage - Core 1.20V
Operating Temperature -40°C ~ 105°C (TC)
Mounting Type Surface Mount
Package / Case 272-BBGA
Supplier Device Package 272-BGA (27x27)

Datasheet

Download the current available datasheet for TMS32C6713BGDPA200.

Download Datasheet

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