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TMS32C6202BGNZA250 Texas Instruments BGA integrated circuit
Part Number

TMS32C6202BGNZA250

Texas Instruments BGA DSP
Available Stock
159 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Texas Instruments
Package
BGA
Category
DSP
Stock
159 pcs
Date Code
2124
Datasheet
Open PDF

Online Order

Quantity Pricing

Quantity Unit Price Ext. Price
1+ $120.00 $120.00
10+ $110.00 $1,100.00
500+ $100.00 $50,000.00
1000+ $95.00 $95,000.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 159 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The Texas Instruments TMS32C6202BGNZA250 is a fixed‑point digital signal processor from the TMS320C6202B family, built on the VelociTI VLIW architecture to deliver clock speeds up to 300 MHz (250 MHz for this speed grade) and 384 KB of internal SRAM. The on‑chip memory is organized as 256 KB of program RAM/cache and 128 KB of data RAM, allowing high‑bandwidth access patterns without external memory stalls. Its core can issue eight 32‑bit instructions per cycle, supporting efficient execution of multiply‑accumulate, filtering, and FFT kernels. The device is housed in a ball‑grid array (BGA) package suitable for high‑density PCB layouts, and its peripheral set enables straightforward interfacing to external memory, host processors, and data converters.

Typical applications include radar and sonar signal processing, software‑defined radio, telecom baseband infrastructure, and high‑end industrial imaging where deterministic fixed‑point computation and low latency are critical. The C62x architecture also appears in motor‑control, test‑and‑measurement, and defense electronic systems. From a procurement perspective, the TMS320C6202B series occupies a mature lifecycle phase—many variants carry a “Not Recommended for New Designs” status from the manufacturer. Engineering and supply‑chain teams should verify the current product status and plan for potential last‑time buys if the part is destined for long‑lifecycle programs. The BGA construction demands careful thermal and mechanical profiling in extended‑temperature or ruggedized environments, and buyers should confirm that the GNZA suffix aligns with the required temperature range and reliability screening level for the target application.

Additional Information

ManufacturerTexas Instruments
Part NumberTMS32C6202BGNZA250
PackageBGA
CategoryDSP
Available Stock159 pcs
Date Code2124

Technical Specifications

Attribute Value
Type Fixed Point
Interface McBSP
Clock Rate 250MHz
Non-Volatile Memory External
On-Chip RAM 384kB
Voltage - I/O 3.30V
Voltage - Core 1.50V
Operating Temperature -40°C ~ 105°C (TC)
Mounting Type Surface Mount
Package / Case 352-BBGA, FCBGA
Supplier Device Package 352-FCBGA (27x27)

Datasheet

Download the current available datasheet for TMS32C6202BGNZA250.

Download Datasheet

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