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TMS320DM6467TZUTD1 Texas Instruments BGA integrated circuit
Part Number

TMS320DM6467TZUTD1

Texas Instruments BGA Integrated Circuits
Available Stock
46 pcs
Lifecycle: Obsolete
End of life
Manufacturer
Texas Instruments
Package
BGA
Stock
46 pcs
Date Code
1032
Datasheet
Open PDF

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Quantity Pricing

Quantity Unit Price Ext. Price
1+ $79.20 $79.20
10+ $72.60 $726.00
500+ $66.00 $33,000.00
1000+ $62.70 $62,700.00

Prices exclude shipping and taxes. Click a tier row to set the quantity.

Availability: 46 pcs

Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.

Overview

The Texas Instruments TMS320DM6467TZUTD1 is a digital media system-on-chip (SoC) from the DaVinci family, integrating an ARM926EJ-S RISC processor and a TMS320C64x+ DSP core within a 529-ball BGA package. The architecture incorporates a high-definition video imaging coprocessor, a video processing subsystem with integrated resizer and on-screen display, and hardware accelerators for multi-format encode and decode operations including H.264, MPEG-4, and JPEG. Complementing the dual-core processing, the device offers a broad peripheral set that includes a 10/100 Ethernet MAC, USB 2.0, PCI, and multiple serial interfaces, allowing direct integration into networked video pipelines.

This SoC is typically deployed in IP video conferencing terminals, industrial machine vision processors, medical imaging platforms, and ruggedized video encoders for airborne or ground-based surveillance systems. Defense and aerospace programs often select the DM6467T for its long-lifecycle processing capabilities, but procurement and design teams should verify active lifecycle status and plan for potential obsolescence. The device is offered in a standard commercial temperature grade; high-reliability applications requiring extended temperature ranges or military-qualified components may need supplementary screening or an alternate path. Assembly considerations for the plastic BGA package include strict moisture sensitivity controls and robust thermal management to ensure long-term board-level reliability.

Additional Information

ManufacturerTexas Instruments
Part NumberTMS320DM6467TZUTD1
PackageBGA
Available Stock46 pcs
Date Code1032

Technical Specifications

Attribute Value
Type Digital Media System-on-Chip (DMSoC)
Interface EBI/EMI, Ethernet, HPI, I2C, McASP, PCI, SPI, UART, USB
Clock Rate 1GHz DSP, 500MHz ARM®
Non-Volatile Memory ROM (8kB)
On-Chip RAM 248kB
Voltage - I/O 1.8V, 3.3V
Voltage - Core 1.30V
Operating Temperature -40°C ~ 85°C (TC)
Mounting Type Surface Mount
Package / Case 529-BFBGA
Supplier Device Package 529-FCBGA (19x19)

Datasheet

Download the current available datasheet for TMS320DM6467TZUTD1.

Download Datasheet

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