Industry certifications and quality credentials
PEX8509-AA25BIG Broadcom (PLX Technology) BGA integrated circuit
Part Number

PEX8509-AA25BIG

Broadcom (PLX Technology) BGA Integrated Circuits
Available Stock
3 pcs
Lifecycle: Obsolete
End of life
Package
BGA
Stock
3 pcs
Date Code
1946
Datasheet
Open PDF

Overview

The PEX8509-AA25BIG is a PCI Express Gen2 switch IC from Broadcom (formerly PLX Technology), integrating 8 lanes and 9 ports in a high-density BGA package. Based on the PEX8509 family architecture, the device supports per-lane data rates of 5.0 GT/s and provides a non-blocking switch fabric with configurable lane widths from x1 to x8 per port. Typical features include cut-through and store-and-forward switching, advanced power management, multiple virtual channels, and full error reporting compliant with the PCIe Base Specification Revision 2.0. The switch enables peer-to-peer communication and flexible host/target topologies, delivering low transaction latency suitable for real-time data movement across multiple endpoints.

Designed for embedded and high-reliability deployments, this switch is used in industrial automation controllers, aerospace data acquisition systems, defense signal processing, medical imaging, and ruggedized single-board computers where deterministic performance and extended temperature operation are critical. The ordering suffix “BIG” denotes an industrial temperature rating and RoHS compliance, extending the operational range to -40°C to +85°C and supporting environmentally demanding installations. Procurement teams should note that Broadcom’s PLX switch products are subject to lifecycle management and may experience allocation or end-of-life notices; industrial-grade variants typically remain available longer than commercial equivalents. As a BGA-packaged device, proper ESD handling and thermal profiling during assembly are essential to ensure long-term reliability.

Additional Information

Part NumberPEX8509-AA25BIG
PackageBGA
Available Stock3 pcs
Date Code1946

Technical Specifications

Attribute Value
Package / Case BGA
Part Status Obsolete
Mounting Type Surface Mount
Pin Count 196 balls
Supply Voltage 1.0 V (VDD10 core/SerDes) / 3.3 V (VDD33 I/O)
Data Rate 2.5 Gbps/lane, 40 Gbps aggregate bandwidth
Operating Temperature -40°C ~ +85°C
Function 8-lane 8-port PCI Express Gen1 switch
Number of Lanes 8 (integrated on-chip SerDes)
Number of Ports 8 (each port configurable as x1/x2/x4)

Datasheet

Download the current available datasheet for PEX8509-AA25BIG.

Download Datasheet

Related Part Numbers

Same Category

View all
HCPL-315J-500E Broadcom SOP integrated circuit
Manufacturer: Broadcom Stock: 10,008
RFQ
M95128-DRMN3TP/K STMicroelectronics SOP integrated circuit
Manufacturer: STMicroelectronics Stock: 9,200
RFQ
HCPL-2631-000E Broadcom SOP integrated circuit
Manufacturer: Broadcom Stock: 8,140
RFQ
12-393 Mercury X-tal DIP integrated circuit
12-393 In Stock
Manufacturer: Mercury X-tal Stock: 6,900
RFQ

Same Package

View all
AR6005G-CF1B-R QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,635
RFQ
MSM-8625-0-576NSP QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,606
RFQ
MSM-8625-0-576NSP-TR-00-0 QUALCOMM BGA integrated circuit
Manufacturer: QUALCOMM Stock: 3,606
RFQ
GD82551IT Intel BGA integrated circuit
GD82551IT In Stock
Manufacturer: Intel Stock: 1,859
RFQ
Scroll to Top