WEDPN16M64V-133B2I

The WEDPN16M64V-133B2I is a high-reliability 16M x 64 synchronous SRAM module from White Electronic Designs, engineered for embedded systems requiring deterministic, high-bandwidth memory. This 1 Gbit density device provides a full 64-bit data path clocked at 133 MHz, utilizing a synchronous pipelined burst architecture with single-cycle deselect and programmable burst sequence. Packaged in a ball-grid array (BGA), the module operates from a nominal 3.3 V supply and integrates multiple internally matched SRAM die to help manage thermal dissipation and signal integrity in compact, high-speed layouts. The “I” suffix designates an industrial temperature range of -40°C to +85°C, making the part suitable for platforms that must perform across extended thermal environments without the full screening of military-grade components.

Typical applications center on high-reliability cache memory for FPGAs, DSPs, and embedded processors within defense, aerospace, and industrial automation systems, including radar signal processors, avionics mission computers, and high-throughput network line cards. White Electronic Designs’ focus on ruggedized memory modules means the WEDPN16M64V series is frequently specified in long-lifecycle programs where bill-of-material stability and configuration control are mandatory. Procurement teams should plan for potentially extended factory lead times typical of niche high-reliability SRAM products and note that this industrial-grade variant differs from full military /883 or MIL-PRF-38535 screened versions. Validating the active production status and evaluating potential obsolescence risks are prudent steps during the design-in and sourcing process.