The PC8245ETPU300D from NXP Semiconductors is a high-reliability (HiRel) grade integrated host processor built around the PowerPC 603e core and featuring an on-chip PCI bridge, making it a single-chip solution for embedded systems requiring both robust computing performance and standardized local bus connectivity. As a member of the MPC8245 family, this 300 MHz device integrates a 32-bit superscalar core with an SDRAM memory controller, dual-channel DMA engines, a programmable interrupt controller, and multiple communication peripherals, all housed in a thermally efficient TBGA (tape ball grid array) package that supports reliable operation across extended temperature ranges.
This HiRel variant is engineered for applications where long-term availability, wide-temperature tolerance, and controlled manufacturing pedigree are paramount. Typical deployments include defense mission computers, aerospace avionics, ruggedized industrial controllers, and safety-critical communications infrastructure, where the processor often serves as the host controller managing system-level PCI traffic and real-time I/O. Procuring the PC8245ETPU300D requires attention to obsolescence risk, as legacy PowerPC-based host processors are subject to limited production windows and manufacturer lifecycle changes; the HiRel screening and extended qualifications inherent to this part number distinguish it from standard commercial grades and can introduce longer lead times. ZZX Electronics ensures supply chain continuity for such high-reliability components, supporting engineers who need to maintain long-life platforms without redesign.
| Attribute | Value |
|---|---|
| Operating Temperature | -55°C ~ 125°C |
| Clock Frequency | 300MHz |
| Qualification | MIL-STD-883 |
| Package / Case | TBGA |
| Mounting Type | Surface Mount |
| I/O Supply Voltage | OVDD = 3.3 V ± 0.3 V; GVDD = 3.3 V ± 5% |
| Power Dissipation @ 66/66/300 | Typical 1.8 W (1.7 W in parentheses); Max-FP 2.3 W (2.0 W); Doze 1.2 W (1.1 W) |
| Supply Voltage (core & peripheral logic) | VDD = 1.8/1.9/2.0 V ±100 mV or 2.0/2.1 V ±100 mV |
| Processor Frequency (300 position) | 300 MHz |
| Die-junction Temperature | 0 ~ 105 °C |
| Storage Temperature | -55 ~ 150 °C |
| Process Technology | 0.25 um CMOS, five-layer metal |
| Revision Level (last character D) | Rev ID: 0x14 |
Download the current available datasheet for PC8245ETPU300D.
Download Datasheet