| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $19.20 | $19.20 |
| 10+ | $17.60 | $176.00 |
| 500+ | $16.00 | $8,000.00 |
| 1000+ | $15.20 | $15,200.00 |
Prices exclude shipping and taxes. Click a tier row to set the quantity.
Price is for reference only. All orders are subject to availability confirmation. Our team will contact you within 24 hours to confirm final pricing and lead time.
The IDT7164S20TDB is a high-speed CMOS static random-access memory (SRAM) device from Renesas Electronics (originally developed by Integrated Device Technology), organized as 8,192 words by 8 bits for a total 64K memory density. Fabricated using advanced silicon-gate CMOS technology, it delivers fast asynchronous access times—the “-20” speed grade indicating a 20 ns rating—while maintaining low active and standby power consumption, a characteristic essential for power-sensitive embedded systems. Housed in a ceramic dual in-line package (CDIP), the component provides excellent thermal and environmental resilience, ensuring stable operation across extended temperature ranges and under mechanical stress typical of high-reliability deployments.
Typical applications span mission-critical embedded platforms, including military avionics computers, radar and electronic warfare signal processors, industrial programmable logic controllers, and aerospace guidance subsystems where deterministic non-volatile operation is not required but fast, reliable scratchpad memory is essential. The CDIP package and legacy design make this part a common choice in extended-life defense programs and high-temperature industrial applications. Procurement engineers should note that, as a mature Renesas/IDT product, the 7164S20TDB may face obsolescence risks and constrained availability; verifying active lifecycle status and requesting a certificate of conformance for any military-standard processing (such as MIL-STD-883 screening when applicable) is strongly recommended. Designing in a compatible low-power SRAM with this footprint also demands attention to supply chain lead times, authentic sourcing, and the need for electrostatic discharge (ESD) and moisture-sensitive handling procedures commensurate with ceramic-packaged ICs.
| Attribute | Value |
|---|---|
| Operating Temperature | -55°C ~ 125°C |
| Memory Size | 8K x 8 |
| Qualification | MIL-STD-883 |
| Package / Case | CDIP |
| Mounting Type | Through Hole |
Download the current available datasheet for IDT7164S20TDB.
Download Datasheet